Please contact us:
Phone: +49 (0) 89 41 11 91-0

The figure shows the construction of a
DLoG MPC aluminum housing.
Clearly seen are the cut-outs for the
direct thermal connection of CPU,
Northbridge and memory to the housing.

Thermal Conduction Concept

We have developed a heat/cold conduction concept that enables us to design our industrial PCs without a fan.

The heat conduction concept of DLoG industrial PCs is based on an aluminum housing and thus enables the direct connection of electronic components such as the CPU, Northbridge and memory to the housing for optimal heat dissipation.

The entire industrial PC housing thus functions as a heat sink while at the same time optimizing material properties such as stability and flexibility against external temperature fluctuations and resistance to adverse environmental influences.